{"created":"2023-07-25T10:28:03.933165+00:00","id":813,"links":{},"metadata":{"_buckets":{"deposit":"2f2a002a-5809-4613-8dd9-75bdbd33417b"},"_deposit":{"created_by":2,"id":"813","owners":[2],"pid":{"revision_id":0,"type":"depid","value":"813"},"status":"published"},"_oai":{"id":"oai:it-hiroshima.repo.nii.ac.jp:00000813","sets":["1:18:378"]},"author_link":["3803","3800","3802","3801"],"item_10002_biblio_info_7":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2009-02","bibliographicIssueDateType":"Issued"},"bibliographicPageEnd":"64","bibliographicPageStart":"57","bibliographicVolumeNumber":"43","bibliographic_titles":[{"bibliographic_title":"広島工業大学紀要. 研究編"}]}]},"item_10002_description_19":{"attribute_name":"フォーマット","attribute_value_mlt":[{"subitem_description":"application/pdf","subitem_description_type":"Other"}]},"item_10002_description_5":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"Epoxy resin is usually used as an encapsulation of IC chips for electronic parts. As for the epoxy resin, a state changes from liquid to solid by the chemical reaction. Hereby, the residual stresses and the warp deformation occur in the electronic parts. In this report, the warp deformation for two laminated bodies consisting of epoxy resin and steel and epoxy resin and printed board, each of which is caused by chemical reaction and thermal load, was examined by the experiment and the theory. In other words, the theoretical contents are the thermo-viscoelastic analysis based on the linear viscoelasticity theory and a simple prediction solution about the laminated bodies consisting of the above-mentioned materials. As a result, it was clarified that the warp deformation for the laminated bodies generated by chemical reaction and thermal load could be predicted by using the combination of thermo-viscoelastic analysis and simple prediction solution which was derived from the bending theory of beam, and that the percentage of the warp deformation caused by chemical reaction was about 15 ～ 20% of the total warp deformation for the laminated bodies.","subitem_description_type":"Abstract"}]},"item_10002_publisher_8":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"広島工業大学"}]},"item_10002_source_id_11":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA11599110","subitem_source_identifier_type":"NCID"}]},"item_10002_source_id_9":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"13469975","subitem_source_identifier_type":"ISSN"}]},"item_10002_subject_21":{"attribute_name":"日本十進分類法","attribute_value_mlt":[{"subitem_subject":"501.4","subitem_subject_scheme":"NDC"}]},"item_10002_version_type_20":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"中村, 省三"},{"creatorName":"ナカムラ, ショウゾウ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{"nameIdentifier":"3800","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"田中, 孝明"},{"creatorName":"タナカ, タカアキ","creatorNameLang":"ja-Kana"}],"nameIdentifiers":[{"nameIdentifier":"3801","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Nakamura, Shozo","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"3802","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Tanaka, Takaaki","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"3803","nameIdentifierScheme":"WEKO"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2023-03-30"}],"displaytype":"detail","filename":"kiyo43057.pdf","filesize":[{"value":"449.8 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"kiyo43057.pdf","url":"https://it-hiroshima.repo.nii.ac.jp/record/813/files/kiyo43057.pdf"},"version_id":"049ec357-1199-42f3-97b5-57538f01194e"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"viscoelasticity","subitem_subject_scheme":"Other"},{"subitem_subject":"warp deformation","subitem_subject_scheme":"Other"},{"subitem_subject":"numerical analysis","subitem_subject_scheme":"Other"},{"subitem_subject":"chemical reaction","subitem_subject_scheme":"Other"},{"subitem_subject":"epoxy resin","subitem_subject_scheme":"Other"},{"subitem_subject":"laminate","subitem_subject_scheme":"Other"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"粘弾性積層体の硬化収縮に起因する反り変形量を求める硬化予測式","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"粘弾性積層体の硬化収縮に起因する反り変形量を求める硬化予測式"},{"subitem_title":"Curing Prediction Solution of Warp Deformation for Viscoelastic Laminated Body with Chemical Reaction","subitem_title_language":"en"}]},"item_type_id":"10002","owner":"2","path":["378"],"pubdate":{"attribute_name":"公開日","attribute_value":"2023-03-30"},"publish_date":"2023-03-30","publish_status":"0","recid":"813","relation_version_is_last":true,"title":["粘弾性積層体の硬化収縮に起因する反り変形量を求める硬化予測式"],"weko_creator_id":"2","weko_shared_id":-1},"updated":"2023-07-25T10:39:19.969035+00:00"}